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Freescale, ELMOS join forces on automotive ASSP development Sep 22, 2006 2:53 PM Freescale Semiconductor (www.freescale.com) and ELMOS Semiconductor AG (www.elmos.de) have joined forces to develop multi-chip application-specific semiconductor products (ASSPs) for next-generation automotive applications. The ASSPs will combine Freescale’s 16-bit S12/S12X microcontroller architecture with ELMOS’s high-voltage CMOS capabilities, and will address intelligent distributed control requirements for body electronics, comfort function motor control and safety applications. The firms also plan to work together on smart sensor and actor nodes with direct bus-link functionality. The key focus of the collaboration is the jointly developed interface that combines integrated circuits from both companies. "Freescale and ELMOS ultimately plan to drive a dedicated line of intelligent co-integrated products for a broad range of automotive applications," said ELMOS chief executive officer Anton Mindl. "The combination of Freescale's and ELMOS' complementary semiconductor design and manufacturing expertise is expected to accelerate the introduction of next-generation system-in-package control devices." |
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